SNIA Fosters Industry Knowledge of Collaborative Standards Engagements

November 2024 was a memorable month to engage with audiences at The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC) 24 and Technology Live! to provide the latest on collaborative standards development and discuss high performance computing, artificial intelligence, and the future of storage.

At SC24, seven industry consortiums participated in an Open Standards Pavilion to discuss their joint activities in memory and interconnect standards, storage standards, networking fabric standards, and management and orchestration. Technology leaders from DMTF, Fibre Channel Industry Association, OpenFabrics Alliance, SNIA, Ultra Accelerator Link Consortium, Ultra Ethernet Consortium, and Universal Chiplet Interconnect Express™ Consortium shared how these standards are collaborating to foster innovation as technology trends accelerate. CXL® Consortium, NVM Express®, and PCI-SIG® joined these groups in a lively panel discussion moderated by Richelle Ahlvers, Vice Chair SNIA Board of Directors, on their cooperation in standards development. Read More

Answering Your Questions on EDSFF

We had a tremendous response to our webcast asking if we were truly at the end of the 2.5-inch disk era. SNIA Compute, Memory, and Storage Initiative SSD Special Interest Group brought together experts from Dell, Facebook, HPE, JEDEC, KIOXIA, Lenovo, and Microsoft in a lively follow on to the Enterprise and Data Center SSD Form Factor (EDSFF) May 2020 discussions at OCP Summit,. If you missed our live webcast – watch it on demand. Webcast attendees raised a variety of questions.  Our experts provide answers to them here: Q:  SFF_TA_1006 suggests E1.S can support max 25W for 25mm asymmetric heat-sink. What are the air-flow assumptions for this estimate? Are there any thermal models and test guidelines available for EDSFF form-factors? Read More